Eng- Power & perf
Power Thermal Software Engineer
Application page liveThe application page answered when we checked it · . Confirm the role is open there before you apply.
The gist
This role involves analyzing power and thermal challenges across Qualcomm's chipsets, developing tools for competitive analysis, and collaborating with cross-functional teams to create optimized system-level solutions. It suits students with a strong background in software engineering and systems design.
What you would actually do
- Profile power and thermal use cases across chipsets
- Develop tools for competitive analysis and mitigation
- Collaborate with cross-functional teams on system-level solutions
Skills mentioned
About this listing
- Found on
- First seen by InternDoor
- , within 2 hours of being posted
- Last seen listed
- Application page
- careers.qualcomm.com
InternDoor has recorded 78 engineering postings from Qualcomm in India since Jul 2026. LinkedIn listings stay on InternDoor for at most 30 days after we first see them, so this one comes down by , or sooner if we find its application has closed. When it comes down, this address points to Qualcomm’s page instead of a dead end.
How to apply
Entry-level roles in India often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth, so check it before you apply.
