Intern - HBM Design Architect | MS or PhD Student
HBM Architecture Analysis
Likely openWe list a role only while we believe it is still open. Confirm on the posting before you apply.
The gist
This internship involves analyzing memory architecture tradeoffs and using AI tools to support semiconductor design. It suits graduate students with strong technical skills in memory systems and simulation. The role offers hands-on experience in cutting-edge memory technologies and collaborative engineering workflows.
What you would actually do
- Evaluate HBM and DRAM architecture tradeoffs using simulation and AI tools
- Collaborate with cross-functional teams on memory technology feasibility
- Leverage LLMs and Generative AI to enhance engineering analysis and productivity
Skills mentioned
About this listing
- Found on
- Micron Technology’s careers site (Workday)
- First seen by InternDoor
- Last seen listed
- Application page
- micron.wd1.myworkdayjobs.com
InternDoor has recorded 131 engineering postings from Micron Technology in the US since Aug 2026. We keep re-checking Micron Technology’s careers site, and take this listing down after the role disappears from it or its application link stops working. When it comes down, this address points to Micron Technology’s page instead of a dead end.
How to apply
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This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.