Intern - Design Engineer, HBM
Memory Design Engineer
Open nowConfirmed on Micron Technology’s own careers page · checked
What stands out
- Posted in the last 24 hours.
The gist
Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven…
What you would actually do
- Design and optimize memory, logic, and analog circuits for HBM products
- Use tools like FineSim, HSPICE, Verilog, and scripting languages for simulation and analysis
- Collaborate with global teams on manufacturability, reliability, and performance
- Leverage AI-Assisted tools to improve design efficiency and support data-driven decisions
Skills mentioned
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.