Intern - HBM SoC Physical Design Engineer
SoC Physical Design
Likely openWe list a role only while we believe it is still open. Confirm on the posting before you apply.
What stands out
- Pay is stated up front — $39 – $50 / hour. Most postings never say.
- Nobody had applied when this was listed — you would be near the front of the queue.
- Posted in the last 24 hours.
The gist
This internship offers hands-on experience in SoC physical design for HBM memory solutions. You'll work on advanced chip implementation, timing analysis, and automation tools. Ideal for students with a master's in electrical or computer engineering seeking exposure to cutting-edge semiconductor design.
What you would actually do
- Support physical implementation of SoC design blocks with floorplanning, placement, and routing
- Use Python, Tcl, and AI tools to develop automation scripts and workflows
- Collaborate with cross-functional teams on timing analysis and design reviews
Skills mentioned
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.