Advanced Packaging Integration and Simulation Intern
Packaging Integration
Open nowConfirmed on Intel’s own careers page · checked
What stands out
- Pay is stated up front — $120,898 – $120,902 / year. Most postings never say.
The gist
This role involves supporting advanced packaging integration and simulation efforts, working on complex semiconductor technologies. Ideal for students with a PhD in engineering or related fields, focusing on hands-on research and collaboration with leading experts.
What you would actually do
- Support packaging integration across wafer-level and package-level processes
- Develop simulation models for thermal and mechanical performance
- Collaborate with cross-functional teams on process optimization
Skills mentioned
About this listing
- Found on
- Intel’s careers site (Workday)
- First seen by InternDoor
- Last seen listed
- Application page
- intel.wd1.myworkdayjobs.com
InternDoor has recorded 64 engineering postings from Intel in the US since Aug 2026. We keep re-checking Intel’s careers site, and take this listing down after the role disappears from it or its application link stops working. When it comes down, this address points to Intel’s page instead of a dead end.
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.