Advanced Packaging Integration and Simulation Intern
Packaging Simulation
Likely openWe list a role only while we believe it is still open. Confirm on the posting before you apply.
What stands out
- Pay is stated up front — $120,898 – $120,902. Most postings never say.
- Nobody had applied when this was listed — you would be near the front of the queue.
- Posted in the last 24 hours.
- The same role is open in 2 locations.
The gist
This internship involves working on advanced packaging integration and simulation projects at Intel. You will support research and development efforts in package integration, process flows, and simulation modeling. Ideal for students with a PhD in mechanical engineering, materials science, or related fields, this role offers hands-on experience with cutting-edge semiconductor technologies and collaboration with leading researchers.
What you would actually do
- Support packaging integration across wafer-level and package-level processes
- Use Python, MATLAB, and simulation tools for thermal and mechanical analysis
- Collaborate with cross-functional teams to improve yield and manufacturability
Skills mentioned
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.