Module Integration Design Engineering Intern
RF Module Design
Likely openWe list a role only while we believe it is still open. Confirm on the posting before you apply.
What stands out
- Pay is stated up front — $36 / hour. Most postings never say.
- Nobody had applied when this was listed — you would be near the front of the queue.
The gist
As a Module Integration Design Engineering Intern, you will design and simulate RF front-end modules for next-generation 5G and 6G smartphones. You will work with cross-functional teams to integrate high-performance hardware components into optimized multi-chip modules, ensuring they meet performance, size, and cost targets. This role suits students with a strong background in RF and analog circuit design, seeking hands-on experience with simulation tools and lab equipment.
What you would actually do
- Design RF front-end modules for 5G and 6G smartphones
- Use HFSS and ADS to simulate and optimize hardware components
- Collaborate with teams to integrate and test multi-chip modules
Skills mentioned
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.