Intern - Wafer Bonding Process Development
Wafer Bonding Research
Open nowConfirmed on Micron Technology’s own careers page · checked
The gist
This internship involves working on advanced wafer bonding technologies for next-generation semiconductors. You will design experiments, analyze data, and use AI tools to improve process performance and manufacturability. Ideal for students with a background in chemical engineering, materials science, or related fields.
What you would actually do
- Design and execute experiments to improve wafer bonding processes and yield
- Use AI tools and analytics to accelerate process development and data analysis
- Collaborate with engineers to evaluate new equipment and materials
Skills mentioned
About this listing
- Found on
- Micron Technology’s careers site (Workday)
- First seen by InternDoor
- Last seen listed
- Application page
- micron.wd1.myworkdayjobs.com
InternDoor has recorded 135 engineering postings from Micron Technology in the US since Aug 2026. We keep re-checking Micron Technology’s careers site, and take this listing down after the role disappears from it or its application link stops working. When it comes down, this address points to Micron Technology’s page instead of a dead end.
How to apply
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