Ph.D. Intern - Advanced Packaging & Physical Integration
Packaging Research
Open nowConfirmed on Marvell Technology’s own careers page · checked
What stands out
- Pay is stated up front — $37 – $73 / hour. Most postings never say.
The gist
This Ph.D. Internship involves solving complex packaging challenges for AI accelerators and high-speed connectivity platforms. You'll work on signal integrity, thermal management, and physical design of multi-die systems, contributing to production-ready solutions used by major hyperscalers. Ideal for doctoral candidates with research experience in semiconductor packaging or related fields.
What you would actually do
- Simulate thermal and mechanical behavior of advanced chiplet packages
- Analyze signal integrity for high-speed interfaces like 224G SerDes
- Collaborate with teams to validate packaging designs against real-world data
Skills mentioned
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.