Ph.D. Intern - Advanced Packaging & Physical Integration
Packaging Simulation
Likely openWe list a role only while we believe it is still open. Confirm on the posting before you apply.
What stands out
- Pay is stated up front — $37 – $73 / hour. Most postings never say.
- Nobody had applied when this was listed — you would be near the front of the queue.
- Posted in the last 24 hours.
- The same role is open in 7 locations.
The gist
This internship involves working on advanced packaging challenges for AI accelerators, focusing on thermal and signal integrity simulations. Ideal for doctoral candidates with research experience in semiconductor packaging or related fields. The role offers hands-on involvement in real-world production platforms used by major hyperscalers.
What you would actually do
- Simulate thermal and mechanical behavior of chiplet packages
- Analyze signal integrity for high-speed interconnects
- Collaborate with teams on packaging design and validation
Skills mentioned
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.