Ph.D. Intern - Advanced Packaging & Physical Integration
Packaging Research
Likely openWe list a role only while we believe it is still open. Confirm on the posting before you apply.
What stands out
- Pay is stated up front — $37 – $73 / hour. Most postings never say.
- Nobody had applied when this was listed — you would be near the front of the queue.
- Posted in the last 24 hours.
- The same role is open in 5 locations.
The gist
This Ph.D. Internship involves solving complex packaging and integration challenges for AI accelerators and high-speed connectivity platforms. You will work on signal integrity, thermal management, and physical design for cutting-edge semiconductor packages that are already in production. Ideal for doctoral candidates with research experience in advanced packaging, signal/power integrity, or related fields.
What you would actually do
- Analyze signal integrity and power delivery for high-speed AI chip packages
- Simulate thermal and mechanical behavior of advanced 2.5D/3D chiplet designs
- Collaborate with engineering teams on real production packaging challenges
Skills mentioned
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.