Semiconductor Advanced Packaging Process Engineering Intern
Semiconductor Packaging Engineering
Likely openWe list a role only while we believe it is still open. Confirm on the posting before you apply.
What stands out
- Pay is stated up front — $53 – $57. Most postings never say.
- Nobody had applied when this was listed — you would be near the front of the queue.
- Posted in the last 24 hours.
The gist
This internship offers hands-on experience in semiconductor packaging processes, working with advanced equipment and data analysis tools. Ideal for students with a background in engineering or materials science, this role involves contributing to process optimization and experimentation in a research environment.
What you would actually do
- Support semiconductor assembly processes for advanced siP products
- Work with thermocompression bonding and inspection equipment
- Analyze process data to improve yield and throughput
Skills mentioned
About this listing
- Found on
- First seen by InternDoor
- , within 34 minutes of being posted
- Last seen listed
- Application page
- jobs.keysight.com
InternDoor has recorded 23 engineering postings from Keysight Technologies in the US since Sept 2026. LinkedIn listings stay on InternDoor for at most 30 days after we first see them, so this one comes down by , or sooner if we find its application has closed. When it comes down, this address points to Keysight Technologies’s page instead of a dead end.
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.