Silicon Technology Research and Development Software Engineering Intern - 2027
Chip design engineering
Likely openWe list a role only while we believe it is still open. Confirm on the posting before you apply.
What stands out
- Pay is stated up front — $75,600 / year. Most postings never say.
- Nobody had applied when this was listed — you would be near the front of the queue.
- Posted in the last 24 hours.
- The same role is open in 2 locations.
The gist
This internship offers hands-on experience in semiconductor research, applying software engineering and computational skills to chip design and packaging. Ideal for students with backgrounds in computer science, data science, or engineering looking to contribute to cutting-edge research.
What you would actually do
- Analyze complex problems and apply creative solutions to chip design
- Work with global researchers on semiconductor and packaging innovations
- Based in yorktown heights, ny for 12 months
Skills mentioned
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.