Hardware and Systems Developer Intern 2027 -New York
Hardware Design
Posted $73,500 / year0 clicked applyHybrid
The gist
This internship involves designing and testing next-generation hardware systems, working on mechanical, thermal, and optical components. Ideal for engineering students with CAD and simulation experience, and a background in materials or electrical engineering.
What you would actually do
- Design and test next-gen hardware using CAD, EDA, and simulation tools
- Work on mechanical, thermal, electrical, and optical systems with SolidWorks, Cadence, and MATLAB
- Develop automation scripts in Python, C/C++, or Bash for testing and validation
Skills mentioned
solidworkscadencepythonmatlabc/c++
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.
More at IBM
All IBM roles →
Research Return Intern
AI Research
Hardware Developer Intern 2027 -Austin
Hardware Testing
Software Developer Intern
Software development
Global Facility Management Process Intern 2027
Facility Process Support
Software QA Development (Apprentice Conversion)
Software Testing
Product Management Intern 2027
Product support