Cloud Hardware Development Engineer Intern, Annapurna Labs - 2027
Firmware Development
Open nowConfirmed on Amazon’s own careers page · checked
What stands out
- Pay is stated up front — $126,100 – $185,000 / year. Most postings never say.
The gist
This internship involves developing firmware and software for custom silicon used in Amazon's cloud infrastructure. You'll work on hardware bring-up, validation, and integration with teams across the company. Ideal for students with experience in hardware design and embedded systems.
What you would actually do
- Write firmware and low-level software for custom silicon used in cloud services
- Debug hardware-software integration using lab equipment and test frameworks
- Collaborate with teams to bring hardware from design to deployment
Skills mentioned
How to apply
Internships in the US often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.