IC Package Process - Internship
Semiconductor Packaging
Likely openWe list a role only while we believe it is still open. Confirm on the posting before you apply.
What stands out
- Only 7 people had applied when this was listed.
- Posted in the last 24 hours.
The gist
This internship involves supporting semiconductor package development and optimization. Interns will work with cross-functional teams to improve manufacturing processes and product quality. Ideal for students with a background in electronics or materials science looking for hands-on experience in semiconductor packaging.
What you would actually do
- Support package development across qfn, fccsp, fcbga, and module-based packages
- Work with design, manufacturing, and osat partners on npi and process optimization
- Analyze data to improve yield and reduce defects in semiconductor packaging
Skills mentioned
How to apply
Internships in India often collect hundreds of applicants within a day, so applying early matters more than applying perfectly. A half-finished application sent on the first morning beats a polished one sent on the third.
This summary was written by InternDoor from the public posting, and is not the employer's own wording. The linked posting is the source of truth — check it before you apply.